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Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach.

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    Title: Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach.
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    Date: 2003
    Publication type: Conference paper
    Authors:
    No. First name Last name Show
    1. Brent Goplen
    2. Sachin S. Sapatnekar
    Download (by DOI): 10.1145/996070.1009873
    BibTeX: conf/iccad/GoplenS03
    DBLP: db/conf/iccad/iccad2003.html#GoplenS03
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    Conference
    Name: 2003 International Conference on Computer-Aided Design (ICCAD'03), November 9-13, 2003, San Jose, CA, USA 2003
    DBLP: db/conf/iccad/iccad2003.html