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Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.

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    Publication properties
    Title: Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
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    Date: 2004
    Publication type: Conference paper
    Authors:
    No. First name Last name Show
    1. C. F. Tsang
    2. C. Y. Li
    3. A. Krishnamoorthy
    4. Y. J. Su
    5. H. Y. Li
    6. L. Y. Wong
    7. W. H. Li
    8. L. J. Tang
    9. K. Y. Ee
    Download (by DOI): 10.1016/j.mejo.2004.06.019
    BibTeX: journals/mj/TsangLKSLWLTE04
    DBLP: db/journals/mj/mj35.html#TsangLKSLWLTE04
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    Journal
    Name: Microelectronics Journal
    Year: 2004
    Volume: 35
    Number: 1
    DBLP: db/journals/mj/mj35.html