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    Author information
    First name: Yintang
    Last name: Yang
    DBLP: 50/5329
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    Below you find the publications which have been written by this author.

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    Journal article
    Cheng Song, Zhangming Zhu, Yintang Yang.
    A Fast-Settling Three-Stage Amplifier Using Regular Miller Plus Reversed Indirect Compensation.
    CSSP 2017, Volume 36 (0) 2017
    Conference paper
    Lianxi Liu, Yu Song, Junchao Mu, Wei Guo, Zhangming Zhu, Yintang Yang.
    A high accuracy CMOS subthreshold voltage reference with offset cancellation and thermal compensation.
    Microelectronics Journal 2017, Volume 60 (0) 2017
    Conference paper
    Haoyu Zhuang, Zhangming Zhu, Jingyu Wang, Yintang Yang.
    CDS Circuit with High-Performance VGA Functionality and Its Design Procedure.
    CSSP 2017, Volume 36 (0) 2017
    Conference paper
    Kai Fan, Hui Li, Wei Jiang, Chengsheng Xiao, Yintang Yang.
    U2F based secure mutual authentication protocol for mobile payment.
    Proceedings of the ACM Turing 50th Celebration Conference - China, TUR-C 2017, Shanghai, China, May 12-14, 2017 2017 (0) 2017
    Conference paper
    Kai Fan, Nan Ge, Yuanyuan Gong, Hui Li, Ruidan Su, Yintang Yang.
    An ultra-lightweight RFID authentication scheme for mobile commerce.
    Peer-to-Peer Networking and Applications 2017, Volume 10 (0) 2017
    Conference paper
    Lianxi Liu, Yiyang Zhou, Junchao Mu, Xufeng Liao, Zhangming Zhu, Yintang Yang.
    A Near-Threshold Voltage Startup Monolithic Boost Converter with Adaptive Sleeping Time Control.
    Journal of Circuits, Systems, and Computers 2017, Volume 26 (0) 2017
    Conference paper
    Kai Fan, Panfei Song, Yintang Yang.
    ULMAP: Ultralightweight NFC Mutual Authentication Protocol with Pseudonyms in the Tag for IoT in 5G.
    Mobile Information Systems 2017, Volume 2017 (0) 2017
    Journal article
    Lu Liu, Zhangming Zhu, Duan Zhou, Yintang Yang.
    A fair arbitration for Network-on-Chip routing with odd-even turn model.
    Microelectronics Journal 2017, Volume 64 (0) 2017
    Journal article
    Zheng Mei, Gang Dong, Yintang Yang, Junping Zheng, Jingrui Chai, Weijun Zhu.
    Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs).
    Microelectronics Journal 2017, Volume 63 (0) 2017
    Journal article
    Zheng Wang, Huaxi Gu, Yawen Chen, Yintang Yang, Kun Wang.
    3D network-on-chip design for embedded ubiquitous computing systems.
    Journal of Systems Architecture - Embedded Systems Design 2017, Volume 76 (0) 2017
    Show item 1 to 10 of 145  

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