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    Journal
    Name: Microelectronics Reliability
    Year: 2016
    Volume: 60
    DBLP: db/journals/mr/mr60.html
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    Below you find the publications assigned to this venue.

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    Journal article
    Piotr Kocanda, Andrzej Kos.
    Improvement of multicores throughput based on environmental conditions.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Deepak Kachave, Anirban Sengupta.
    Integrating physical level design and high level synthesis for simultaneous multi-cycle transient and multiple transient fault resiliency of application specific datapath processors.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen.
    Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    J. Chen, Takamasa Kawanago, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, D. Nohata, Hiroshi Nohira, Kuniyuki Kakushima.
    La
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Zhenyu Zhao, Lei Liu, Hyun Seok Choi, Jian Cai, Qian Wang, Yuming Wang, Guisheng Zou.
    Effect of nano-Al
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Alejandro Velasco, Bartolomeo Montrucchio, Maurizio Rebaudengo.
    KITO tool: A fault injection environment in Linux kernel data structures.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Kaiming Nie, Jianxin Li, Zhiyuan Gao, Jiangtao Xu.
    A transient noise simulation model for the analysis of the optimal number of stages of the analog accumulator in TDI CMOS image sensors.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    X. Y. Wang, Q. Cheng, X. P. Ma, H. Zhang, M. X. Li, T. N. Chen, P. Zhang, J. Q. Shao.
    Improvement of reliability for high-ohmic Cr-Si thin film resistors in a heat and humid environment: Removing moisture source by electrocatalytic decomposition of water.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Mingzhi Dai.
    A subgap density of states modeling for the transient characteristics in oxide-based thin-film transistors.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Journal article
    Adeel Ahmad Bajwa, Jürgen Wilde.
    Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices.
    Microelectronics Reliability 2016, Volume 60 (0) 2016
    Show item 1 to 10 of 21  

    Your query returned 21 matches in the database.